Samsung, SK Hynix, and 180 Companies Gather in Suwon for Semiconductor Packaging Industry Expo
180 semiconductor companies, including Samsung Electronics and SK Hynix, are gathering in Suwon to showcase advanced packaging technology.
The aim is to bring together the latest trends in post-process technology that determines the competitiveness of artificial intelligence (AI) semiconductors and to expand technology exchange between companies and experts.
According to Suwon City on the 26th, the '2026 Next-Generation Semiconductor Packaging Industry Expo (ASPS)' opened at Suwon Convention Center that day. Co-hosted by the city and Gyeonggi Province, it will run for four days through the 28th.
Packaging is a critical post-process technology that increases performance and power efficiency by connecting and integrating semiconductor chips at high density. As semiconductor fine-process technology approaches its limits, how chips are stacked and connected has come to determine performance, making it a key technology attracting attention as the core of the AI semiconductor era.
180 companies are operating 400 booths at the expo to display related advanced technologies including semiconductor packaging and testing process equipment, materials, components, and technology solutions. In addition to the industrial exhibition, a semiconductor packaging forum, purchasing consultation sessions, job fair, and company-specific technology seminars will be held over the four days.
The International Semiconductor Executive Summit (ISIG Executive Summit Korea), attended by executives from global semiconductor companies, will also be held during the same period. The event serves as a forum to discuss next-generation semiconductor core technology roadmaps and global collaboration strategies, and held a joint opening ceremony with the industry expo.
On opening day, a semiconductor packaging trends forum was held under the theme of "AI Era, From Chips to Systems - The Great Transformation of Semiconductor Packaging." Speakers discussed the direction of innovation in the AI semiconductor packaging value chain.
Professor Freddy Gaveya of Hebrew University of Jerusalem presented on the geopolitics of chiplets and advanced packaging amid AI hegemony competition. Ti (Texas Instruments) Korea Director Cho Jin-woo presented on the technology convergence of GaN power semiconductors and advanced packaging for AI data center innovation. Im Yong-woo, Commercial Counselor of the Quebec Government Representative Office in Korea, introduced Quebec's semiconductor ecosystem and cooperation opportunities, while Lee Hui-seok, Senior Vice President of Samsung Electronics, continued with a presentation on "Packaging for AI, AI for Packaging."
The city will also operate a joint booth during the expo period. Three companies in the city—Optz Co., Ltd., Metasol Co., Ltd., and MS Technology Co., Ltd.—will introduce their products and technologies at booths. The city will also promote business attraction by introducing investment sites and incentives through the joint booth.
Detailed information about expo programs and participation methods can be found on the official website (www.semipkgshow.com).
Suwon Mayor Lee Jae-joon said, "We are in an era where semiconductor packaging technology determines the competitiveness of AI semiconductors," and "I hope this industry expo becomes a solid foundation for driving innovation in the packaging industry and achieving growth."
He continued, "Suwon City is building an advanced industrial ecosystem centered on semiconductors, AI, and biotechnology where research, demonstration, and startups work organically together, and is transforming into an 'advanced science research city,' and we will support technological innovation of small and medium-sized companies to lay the foundation for a global advanced science research city."